Plastics piping systems. Glass-reinforced thermosetting plastics (GRP) based on unsaturated polyester resin (UP). Report on the determination of mean abrasion after a defined number of test cycles seo-ignore 3 Performance requirements

3 Performance requirements

A semiconductor device is an electronic component that contains the electronic properties of a semiconductor material

On lines equipped with ERTMS/ETCS Level 2 there may be some additional signs needed for maintenance

provided that their particular structure justifies its application

Plastics piping systems. Glass-reinforced thermosetting plastics (GRP) based on unsaturated polyester resin (UP). Report on the determination of mean abrasion after a defined number of test cycles seo-ignore 3 Performance requirements1 Scope This Technical Report describes a method for determining the mean abrasion of the inner surface of glass reinforced thermosetting polyester resin (GRP) pipes conforming to EN 14364, measured after a defined number of test cycles of a specified water abrasive mixture. NOTE The test is performed on a semi circular channel pipe test piece.