Electronics assembly technology - Endurance test methods for solder joint of area array type package surface mount devices Ingestion-build-51747 This International Standard specifies a

This International Standard specifies a preloading test which is able to detect the occurence of hydrogen embrittlement of fasteners at room temperature

you can be ensured of the test procedure used to determine total oxygen content

d)      A segregation test has been introduced

with their definitions

Electronics assembly technology - Endurance test methods for solder joint of area array type package surface mount devices Ingestion-build-51747 This International Standard specifies a1 Scope This part of IEC 62137 specifies the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo mechanical stress. This part of IEC 62137 applies to the surface mounting semiconductor devices with area array type packages (FBGA, BGA, FLGA and LGA) including peripheral termination type packages (SON and QFN) that are intended to be used in industrial and