US$ 154.50
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Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 4"dia x 0.5 mm t, N type, As-doped 1SP, R:0.001-0.005 ohm.cm Electrode Coating Preparation Resistivity:>(0
$147.47
Description
Resistivity:>(0
by MTI's Film coater MSK-AFA-II-VC
the urethane absorbs the energy of the hammer blow
2% wt Ce doped)
Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 4"dia x 0.5 mm t, N type, As-doped 1SP, R:0.001-0.005 ohm.cm Electrode Coating Preparation Resistivity:>(0Thermal oxide Layer Research Grade , about 80 % useful area SiO2 layer on 4'' Silicon wafer Oxide layer thickness: 300 nm ( 3000A) + 10% Refractive index 1. 455 Silicon Wafer Specifications: Conductive type: N type As doped Resistivity: 0. 001 0. 005 ohm. cm (If you would like to measure the resistivity accurately, please order our Portable 4 Probe Resistivity Testing Instrument.) Size: 4" diameter + 0. 5 mm x 0. 5 mm Orientation: (100) + 1o Polish:
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