Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore The dependence of the spectral

The dependence of the spectral characteristics of a laser on its operating conditions may also be important

Annex C (informative) includes significant technical differences between this document and EN 14434:2004

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Semiconductor devices. Mechanical and climatic test methods - Solderability algolia-ignore The dependence of the spectral1 Scope This part of IEC 60749 establishes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin lead (SnPb) or lead free (Pb free) solder for the attachment. This test method provides a procedure for dip and look solderability testing of through hole, axial and surface mount devices (SMDs) as well as an optional procedure for a board mounting solderability