Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 3"dia x 0.50 mm t,undoped N type, 1SP R:>1000 ohm.cm active surface area 50 cm2

Thermal Oxide Wafer: 300 nm SiO2 Layer on Si (100), 3"dia x 0.50 mm t,undoped N type, 1SP R:>1000 ohm.cm active surface area 50 cm2Thermal oxide Layer Research Grade , about 80 % useful area SiO2 layer on 3" Silicon wafer Oxide layer thickness: 300 nm ( 3000A) + 10% Refractive index 1. 455 Silicon Wafer Specifications: Conductive type: N type un dped Resistivity: >1000 ohm. cm Size: 3"diameter + 0. 5 mm x 0. 5 mm Orientation: (100) + 1o Polish: one side polished Surface roughness, Ra: < 5A (RMS) Related Products Thin Films A Z Crystal wafer A Z Plasma Cleaner Wafer Containers

Use anti-rust oil after the operation and store the kit inside the original box in a dry place to avoid rusting

Note: Please store moisture sensitive consumables in vacuum storage box

(60mm to 1'')

20) mm    x 1

Specifications Crimper

Sieve Set No

Battery Powders

Item Description Qty 1 Battery analyzer + Brand new laptop with MS Windows 11 system and battery analyzer operation software installed 1 pc 2 RS232-to-USB Adapter for connecting the analyzer to the USB port on the computer 1 pc 3 Test-Control software 5

Improper use is deemed below

Orientation: (001) +/-0

85% Specific heat capacity 836 J/kg · K Linear Thermal Expansion () 10 ~ 12 x 10^-6/K (

Spacer (Stainless steel round plate in the picture): 2