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Description

Wafer Cleaving / Glass Breaking PliersDESCRIPTION These light weight tweezers and pliers are non absorbent, have a positive, gentle grip, are non magnetic and the tips do not open when extra pressure is applied. They resist acetone, alcohol and most acids. Static dissipative (carbon fiber reinforced) versions are available for most models. Ideal for sample preparation, microscopy, etching, electronics, instrumentation, laboratories, forensics and delicate wafer handling. Especially useful

The DLC coating is hard and has a thickness of only 2 um to retain high elasticity

Can withstand temperatures up to 300°F (150°C)

Tip Geometry: Critical Dimension (Overhang) Tip Height: 10 - 20 Tip Set Back( RNG): 5 - 15 Tilt Compensation: cell2

with SCANASYST-AIR-HPI-SS probes

~ 1e-13EMU

Sold in 2 sizes: a container holding 1 pint (473ml) or a container holding 50 grams (approx

Bruker's Value Line Probe for Electrical Characterization using Contact Mode in air

Width x Thickness 5385-2SU PELCO® Pro Superalloy

- non-certified

The pattern height is approximately 15nm

Especially useful for handling ESD sensitive components

MMTMEC and MTFML