G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes StdTpc-Equipment Models independent of thickness variation and

independent of thickness variation and surface finish

金属発生限度

SEMI E58 ¾ Automated Reliability

such as an optical filar

G02100 - SEMI G21 - Specification for Plating Integrated Circuit Leadframes StdTpc-Equipment Models independent of thickness variation andNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Standard specifies the requirements for plating layers on leadframes intended for use at the upcoming inspection. The specifications and test procedures detailed in this Standard apply to the internal section of