E04000 - SEMI E40 - Specification for Processing Management Revision:SEMI E40-96 - Superseded Wafer thinning technology becomes popular

Wafer thinning technology becomes popular to meet the demand for thin packages

本試験方法の目的は，ダイ剪断強度試験用の手順を決定することである。

This Document provides particle specification for gases

6-95 (first published)

E04000 - SEMI E40 - Specification for Processing Management Revision:SEMI E40-96 - Superseded Wafer thinning technology becomes popular* This Standard has the option to purchase the Current document with a redline document (Current + Redline). The redline document is included with the Current document as a comparison tool to help identify changes that have been made between the Current version and the previous version (Superseded). If differences should exist between the redline document and the Current document, the Current version is the official and authoritative version. 1