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Description

PELCO® FIB Lift-Out Half GridDESCRIPTION The PELCO FIB Lift Out Half Grid is made of stiff copper beryllium with a thickness of 100m (0. 004"). Has two dots on one side for easy identification. Diameter 3mm with a height of 1. 5mm. Slot is 2mm wide x 0. 5mm deep. This robust half grid offers easy handling and good protection for the TEM lamellas. PELCO Half Grids for FIB Applications, vial 25 PELCO FIB Lift Out TEM Grids Available in Cu, Mo and Si The PELCO FIB Lift Out TEM Grids

Carbon flakes in an inorganic silicate solution for bonding resisting up to 2000°C

Fine 5AX 113mm NM-SS 0

AFM: use in contact

15µm for Ti

5 Back Angle: 1

Width x Thickness 4710-NM PELCO® Pro Locking

Type: P (Boron) (1 primary flat)

Sold in packs of 25

and a certificate of calibration from VLSI

similar in geometry to standard Silicon AFM probes but incorporate a resistive heater at the end of the cantilever

It may also be used as a calibration specimen

Hole Width 200µm